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version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 change history version 1.0 (july 2002) * first copy. * based on version 1.1 (july 2002) 256/288mbit a-die 32 bit rimm datasheet
page 1 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 overview the 32 bit rimm ? module is a general purpose high-perfor- mance line of memory modules suitable for use in a broad range of applications including computer memory, personal computers, workstations, and other applications where high bandwidth and low latency are required. the 32 bit rimm module consists of 256mb/288mb rdram ? devices. these are extremely high-speed cmos drams organized as 16m words by 16 or 18 bits. the use of rambus signaling level (rsl) technology permits the use of conventional system and board design technologies. rimm 3200 modules support 800mhz transfer rate per pin, resulting in total module bandwidth of 3200mb/s or 3.2gb/s. rimm 4200 modules support 1066mhz transfer rate per pin, resulting in total module bandwidth of 4200mb/s or 4.2gb/s. the 32 bit rimm module provides two independent 16 or 18 bit memory channels to facilitate compact system design. the "thru" channel enters and exits the module to support a connection to or from a controller, memory slot, or termina- tion. the "term" channel is terminated on the module and supports a connection from a controller or another memory slot. the rdram architecture enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed memory transactions. the separate control and data buses with independent row and column control yield over 95% bus efficiency. the rdram device multi-bank architecture supports up to four simultaneous transactions per device. features 2 independent rdram channels, 1 pass through and 1 terminated on 32 bit rimm module high speed 800 and 1066mhz rdram devices 232 edge connector pads with 1mm pad spacing module pcb size: 133.35mm x 34.93mm x 1.27mm (5.25? x 1.375? x 0.05?) each rdram has 32 banks, for a total of 512, 256, 128 banks on each 512/576mb, 256/288mb, 128/144mb module respec- tively gold plated edge connector pad contacts serial presence detect (spd) support operates from a 2.5 volt supply ( 5%) low power and powerdown self refresh modes separate row and column buses for higher efficiency wbga package (92 balls) key timing parameters the following table lists the frequency and latency bins available for 32 bit rimm modules. form factor the 32 bit rimm modules are offered in 232-pad 1mm edge connector pad pitch suitable for 232 contact rimm connec- tors. figure 1 below, shows a sixteen device 32 bit rimm module. table 1: 32 bit rimm module frequency and latency organi- zation speed part number i/o freq. (mhz) t rac (row access time) ns rimm 4200 32m x 32/36 1066mhz 32p md16/18r1624df0-ct9 32 md16/18r1624df0-cn9 35 md16/18r1624df0-cm9 64m x 32/36 32p md16/18r1628df0-ct9 32 md16/18r1628df0-cn9 35 md16/18r1628df0-cm9 128m x 32/36 32p md16/18r162gdf0-ct9 32 md16/18r162gdf0-cn9 35 md16/18r162gdf0-cm9 rimm 3200 32m x 32/36 800mhz 40 md16/18r1624df0-cm8 45 md16/18r1624df0-ck8 64m x 32/36 40 md16/18r1628df0-cm8 45 md16/18r1628df0-ck8 128m x 32/36 40 md16/18r162gdf0-cm8 45 md16/18r162gdf0-ck8 (16mx16)*4(8/16)pcs rimm tm module based on 256mb d-die, 32s banks,16k/32ms ref, 2.5v (16mx18)*4(8/16)pcs rimm tm module based on 288mb d-die, 32s banks,16k/32ms ref, 2.5v figure 1 : 32 bit rimm module with heat spreader removed note: on double sided modules, rdrams are also installed on bottom side of pcb.
page 2 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 table 2: module pad numbers and signal names pin pin name pin pin name pin pin name pin pin name a1 gnd b1 gnd a59 gnd b59 gnd a2 sck_thru_l b2 cmd_thru_l a60 vterm b60 vterm a3 gnd b3 gnd a61 vterm b61 vterm a4 dqa8_thru_l b4 dqa7_thru_l a62 gnd b62 gnd a5 gnd b5 gnd a63 dqa3_thru_r b63 dqa4_thru_r a6 dqa6_thru_l b6 dqa5_thru_l a64 gnd b64 gnd a7 gnd b7 gnd a65 dqa5_thru_r b65 dqa6_thru_r a8 dqa4_thru_l b8 dqa3_thru_l a66 gnd b66 gnd a9 gnd b9 gnd a67 dqa7_thru_r b67 dqa8_thru_r a10 dqa2_thru_l b10 dqa1_thru_l a68 gnd b68 gnd a11 gnd b11 gnd a69 vdd b69 vdd a12 dqa0_thru_l b12 ctmn_thru_l a70 gnd b70 gnd a13 gnd b13 gnd a71 sck_thru_r b71 ctmn_term_l a14 cfm_thru_l b14 ctm_thru_l a72 gnd b72 gnd a15 gnd b15 gnd a73 cmd_thru_r b73 ctm_term_l a16 cfmn_thru_l b16 row2_thru_l a74 gnd b74 gnd a17 gnd b17 gnd a75 vref b75 vcmos a18 row1_thru_l b18 row0_thru_l a76 vdd b76 vdd a19 gnd b19 gnd a77 svdd b77 swp a20 col4_thru_l b20 col3_thru_l a78 vdd b78 vdd a21 gnd b21 gnd a79 scl b79 sda a22 col2_thru_l b22 col1_thru_l a80 vdd b80 vdd a23 gnd b23 gnd a81 sa0 b81 sa1 a24 col0_thru_l b24 dqb0_thru_l a82 vdd b82 vdd a25 gnd b25 gnd a83 sa2 b83 sin_term a26 dqb1_thru_l b26 dqb2_thru_l a84 gnd b84 gnd a27 gnd b27 gnd a85 dqb8_term b85 dqb7_term a28 dqb3_thru_l b28 dqb4_thru_l a86 gnd b86 gnd a29 gnd b29 gnd a87 dqb6_term b87 dqb5_term a30 dqb5_thru_l b30 dqb6_thru_l a88 gnd b88 gnd a31 gnd b31 gnd a89 dqb4_term b89 dqb3_term a32 dqb7_thru_l b32 dqb8_thru_l a90 gnd b90 gnd a33 gnd b33 gnd a91 dqb2_term b91 dqb1_term a34 sout_thru b34 sin_thru a92 gnd b92 gnd a35 gnd b35 gnd a93 dqb0_term b93 col0_term a36 dqb8_thru_r b36 dqb7_thru_r a94 gnd b94 gnd a37 gnd b37 gnd a95 col1_term b95 col2_term a38 dqb6_thru_r b38 dqb5_thru_r a96 gnd b96 gnd a39 gnd b39 gnd a97 col3_term b97 col4_term a40 dqb4_thru_r b40 dqb3_thru_r a98 gnd b98 gnd a41 gnd b41 gnd a99 row0_term b99 row1_term a42 dqb2_thru_r b42 dqb1_thru_r a100 gnd b100 gnd a43 gnd b43 gnd a101 row2_term b101 cfmn_term a44 dqb0_thru_r b44 col0_thru_r a102 gnd b102 gnd a45 gnd b45 gnd a103 ctm_term_r b103 cfm_term a46 col1_thru_r b46 col2_thru_r a104 gnd b104 gnd
page 3 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 a47 gnd b47 gnd a105 ctmn_term_r b105 dqa0_term a48 col3_thru_r b48 col4_thru_r a106 gnd b106 gnd a49 gnd b49 gnd a107 dqa1_term b107 dqa2_term a50 row0_thru_r b50 row1_thru_r a108 gnd b108 gnd a51 gnd b51 gnd a109 dqa3_term b109 dqa4_term a52 row2_thru_r b52 cfmn_thru_r a110 gnd b110 gnd a53 gnd b53 gnd a111 dqa5_term b111 dqa6_term a54 ctm_thru_r b54 cfm_thru_r a112 gnd b112 gnd a55 gnd b55 gnd a113 dqa7_term b113 dqa8_term a56 ctmn_thru_r b56 dqa0_thru_r a114 gnd b114 gnd a57 gnd b57 gnd a115 cmd_term b115 sck_term a58 dqa1_thru_r b58 dqa2_thru_r a116 gnd b116 gnd table 2: module pad numbers and signal names (continued) pin pin name pin pin name pin pin name pin pin name table 3: module connector pad description signal module connector pads i/o type description cfm_thru_l a14 i rsl clock from master. connects to left rdram device on "thru" channel. interface clock used for receiving rsl signals from the controller. positive polarity. cfm_thru_r b54 i rsl clock from master. connects to right rdram device on "thru" channel. interface clock used for receiving rsl signals from the controller. positive polarity. cfmn_thru_l a16 i rsl clock from master. connects to left rdram device on "thru" channel. interface clock used for receiving rsl signals from the controller. negative polarity. cfmn_thru_r b52 i rsl clock from master. connects to right rdram device on "thru" channel. interface clock used for receiving rsl signals from the controller. negative polarity. cmd_thru_l b2 i v cmos serial command input used to read from and write to the control registers. also used for power management. connects to left rdram device on "thru" channel. cmd_thru_r a73 i v cmos serial command input used to read from and write to the control registers. also used for power management. connects to right rdram device on "thru" channel. col4_thru_l..c ol0_thru_l a20, b20, a22, b22, a24 i rsl "thru" channel column bus. 5-bit bus containing control and address information for column accesses. connects to left rdram device on "thru" channel. col4_thru_r..c ol0_thru_r b48, a48, b46, a46, b44 i rsl "thru" channel column bus. 5-bit bus containing control and address information for column accesses. connects to right rdram device on "thru" channel . ctm_thru_l b14 i rsl clock to master. connects to left rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. positive polarity.
page 4 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 ctm_thru_r a54 i rsl clock to master. connects to right rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctmn_thru_l b12 i rsl clock to master. connects to left rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. ctmn_thru_r a56 i rsl clock to master. connects to right rdram device on "thru" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. dqa8_thru_l.. dqa0_thru_l a4, b4, a6, b6, a8, b8, a10, b10, a12 i/o rsl "thru" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to left rdram device on "thru" channel. dqa8_thru_l is non-functional on modules with x16 rdram devices. dqa8_thru_r.. dqa0_thru_r b67, a67, b65, a65, b63, a63, b58, a58, b56 i/o rsl "thru" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to right rdram device on "thru" channel. dqa8_thru_r is non-functional on modules with x16 rdram devices. dqb8_thru_l.. dqb0_thru_l b32, a32, b30, a30, b28, a28, b26, a26, b24 i/o rsl "thru" channel data bus b. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to left rdram device on "thru" channel. dqb8_thru_l is non-functional on modules with x16 rdram devices. dqb8_thru_r.. dqb0_thru_r a36, b36, a38, b38, a40, b40, a42, b42, a44 i/o rsl "thru" channel data bus b. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?thru? channel. connects to right rdram device on "thru" channel. dqb8_thru_r is non-functional on modules with x16 rdram devices. row2_thru_l.. row0_thru_l b16, a18, b18 i rsl row bus. 3-bit bus containing control and address information for row accesses. connects to left rdram device on "thru" channel. row2_thru_r.. row0_thru_r a52, b50, a50 i rsl row bus. 3-bit bus containing control and address information for row accesses. connects to right rdram device on "thru" chan- nel. sck_thru_l a2 i v cmos serial clock input. clock source used to read from and write to "thru" channel rdram control registers. connects to left rdram device on "thru" channel. sck_thru_r a71 i v cmos serial clock input. clock source used to read from and write to "thru" channel rdram control registers. connects to right rdram device on "thru" channel. sin_thru b34 i/o v cmos "thru" channel serial i/o for reading from and writing to the con- trol registers. attaches to sio0 of right rdram device on "thru" channel. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 5 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 sout_thru a34 i/o v cmos "thru" channel serial i/o for reading from and writing to the con- trol registers. attaches to sio1 of left rdram device on "thru" channel. cfm_term b103 i rsl clock from master. connects to right rdram device on "term" channel. interface clock used for receiving rsl signals from the controller. positive polarity. cfmn_term b101 i rsl clock from master. connects to right rdram device on "term" channel. interface clock used for receiving rsl signals from the controller. negative polarity. cmd_term a115 i v cmos serial command input used to read from and write to the control registers. also used for power management. connects to right rdram device on "term" channel. col4_term.. col0_term b97, a97, b95, a95, b93 i rsl "term" channel column bus. 5-bit bus containing control and address information for column accesses. connects to right rdram device on "term" channel. ctm_term_l b73 i rsl clock to master. connects to left rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctm_term_r a103 i rsl clock to master. connects to right rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. positive polarity. ctmn_term_l b71 i rsl clock to master. connects to left rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. ctmn_term_r a105 i rsl clock to master. connects to right rdram device on "term" channel. interface clock used for transmitting rsl signals to the controller. negative polarity. dqa8_term.. dqa0_term b113, a113, b111, a111, b109, a109, b107, a107, b105 i/o rsl "term" channel data bus a. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?term? channel. connects to right rdram device on "term" channel. dqa8_term is non-functional on modules with x16 rdram devices. dqb8_term.. dqb0_term a85, b85, a87, b87, a89, b89, a91, b91, a93 i/o rsl "term" channel data bus b. a 9-bit bus carrying a byte of read or write data between the controller and rdram devices on ?term? channel. connects to right rdram device on "term" channel. dqb8_term is non-functional on modules with x16 rdram devices. row2_term.. row0_term a101, b99, a99 i rsl "term" channel row bus. 3-bit bus containing control and address information for row accesses. connects to right rdram device on "term" channel. sck_term b115 i v cmos serial clock input. clock source used to read from and write to "term" channel rdram control registers. connects to right rdram device on "term" channel. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 6 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 sin_term b83 i/o v cmos "term" channel serial i/o for reading from and writing to the con- trol registers. attaches to sio0 of left rdram device on "term" channel. v term a60, b60, a61, b61 "term" channel termination voltage. gnd a1, a3, a5, a7, a9, a11, a13, a15, a17, a19, a21, a23, a25, a27, a29, a31, a33, a35, a37, a39, a41, a43, a45, a47, a49, a51, a53, a55, a57, a59, a62, a64, a66, a68, a70, a72, a74, a84, a86, a88, a90, a92, a94, a96, a98, a100, a102, a104, a106, a108, a110, a112, a114, a116, b1, b3, b5, b7, b9, b11, b13, b15, b17, b19, b21, b23, b25, b27, b29, b31, b33, b35, b37, b39, b41, b43, b45, b47, b49, b51, b53, b55, b57, b59, b62, b64, b66, b68, b70, b72, b74, b84, b86, b88, b90, b92, b94, b96, b98, b100, b102, b104, b106, b108, b110, b112, b114, b116 ground reference for rdram core and interface. sa0 a81 i sv dd serial presence detect address 0. sa1 b81 i sv dd serial presence detect address 1. sa2 a83 i sv dd serial presence detect address 2. scl a79 i sv dd serial presence detect clock. sda b79 i/o sv dd serial presence detect data (open collector i/o). sv dd a77 spd voltage. used for signals scl, sda, swe, sa0, sa1 and sa2. swp b77 i sv dd serial presence detect write protect (active high). when low, the spd can be written as well as read. v cmos b75 cmos i/o voltage. used for signals cmd, sck, sin, sout. vdd a69, b69, a76, b76, a78, b78, a80, b80, a82, b82 supply voltage for the rdram core and interface logic. vref a75 logic threshold reference voltage for both "thru" channel and "term" channel rsl signals. table 3: module connector pad description (continued) signal module connector pads i/o type description
page 7 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 figure 1: 32 bit rimm module functional diagram d q a 8 d q a 7 d q a 6 d q a 5 d q a 4 d q a 3 d q a 2 d q a 1 d q a 0 c f m c f m n c t m c t m n r o w 2 r o w 1 r o w 0 c o l 4 c o l 3 c o l 2 c o l 1 c o l 0 d q b 0 d q b 1 d q b 2 d q b 3 d q b 4 d q b 5 d q b 6 d q b 7 d q b 8 sio 0 sio 1 sck cmd v ref ( 256/288mb) d q a 8 _ t h r u _ r d q a 7 _ t h r u _ r d q a 6 _ t h r u _ r d q a 5 _ t h r u _ r d q a 4 _ t h r u _ r d q a 3 _ t h r u _ r d q a 2 _ t h r u _ r d q a 1 _ t h r u _ r d q a 0 _ t h r u _ r c f m _ t h r u _ r c f m n _ t h r u _ r c t m _ t h r u _ r c t m n _ t h r u _ r r o w 2 _ t h r u _ r r o w 1 _ t h r u _ r r o w 0 _ t h r u _ r c o l 4 _ t h r u _ r c o l 3 _ t h r u _ r c o l 2 _ t h r u _ r c o l 1 _ t h r u _ r c o l 0 _ t h r u _ r d q b 0 _ t h r u _ r d q b 1 _ t h r u _ r d q b 2 _ t h r u _ r d q b 3 _ t h r u _ r d q b 4 _ t h r u _ r d q b 5 _ t h r u _ r d q b 6 _ t h r u _ r d q b 7 _ t h r u _ r d q b 8 _ t h r u _ r d q a 8 _ t h r u _ l d q a 7 _ t h r u _ l d q a 6 _ t h r u _ l d q a 5 _ t h r u _ l d q a 4 _ t h r u _ l d q a 3 _ t h r u _ l d q a 2 _ t h r u _ l d q a 1 _ t h r u _ l d q a 0 _ t h r u _ l c f m _ t h r u _ l c f m n _ t h r u _ l c t m _ t h r u _ l c t m n _ t h r u _ l r o w 2 _ t h r u _ l r o w 1 _ t h r u _ l r o w 0 _ t h r u _ l c o l 4 _ t h r u _ l c o l 3 _ t h r u _ l c o l 2 _ t h r u _ l c o l 1 _ t h r u _ l c o l 0 _ t h r u _ l d q b 0 _ t h r u _ l d q b 1 _ t h r u _ l d q b 2 _ t h r u _ l d q b 3 _ t h r u _ l d q b 4 _ t h r u _ l d q b 5 _ t h r u _ l d q b 6 _ t h r u _ l d q b 7 _ t h r u _ l d q b 8 _ t h r u _ l left rdram device of "thru" channel s o u t _ t h r u s c k _ t h r u _ r c m d _ t h r u _ l v r e f s i n _ t h r u vdd g nd 2 per rdram device scl sda a0 a1 scl sa0 sa1 serial presence detect d q a 8 d q a 7 d q a 6 d q a 5 d q a 4 d q a 3 d q a 2 d q a 1 d q a 0 c f m c f m n c t m c t m n r o w 2 r o w 1 r o w 0 c o l 4 c o l 3 c o l 2 c o l 1 c o l 0 d q b 0 d q b 1 d q b 2 d q b 3 d q b 4 d q b 5 d q b 6 d q b 7 d q b 8 sio 0 sio 1 sck cmd v ref ( 256/288mb) v ref g nd 1 p er 2 rdram devices v cmos g nd 1 p er 2 rdram devices a2 sa 2 swp swp u0 vcc s v dd 0.22/0.1 m f a *0.22/0.1 m f a *0.22/0.1 m f a sv dd g nd *0.22/0.1 m f a . . . plus one near connector right rdram device of "thru" channel d q a 8 d q a 7 d q a 6 d q a 5 d q a 4 d q a 3 d q a 2 d q a 1 d q a 0 c f m c f m n c t m c t m n r o w 2 r o w 1 r o w 0 c o l 4 c o l 3 c o l 2 c o l 1 c o l 0 d q b 0 d q b 1 d q b 2 d q b 3 d q b 4 d q b 5 d q b 6 d q b 7 d q b 8 sio 0 sio 1 sck cmd v ref ( 256/288mb) d q a 8 _ t e r m d q a 7 _ t e r m d q a 6 _ t e r m d q a 5 _ t e r m d q a 4 _ t e r m d q a 3 _ t e r m d q a 2 _ t e r m d q a 1 _ t e r m d q a 0 _ t e r m c f m _ t e r m c f m n _ t e r m c t m _ t e r m _ r c t m n _ t e r m _ r r o w 2 _ t e r m r o w 1 _ t e r m r o w 0 _ t e r m c o l 4 _ t e r m c o l 3 _ t e r m c o l 2 _ t e r m c o l 1 _ t e r m c o l 0 _ t e r m d q b 0 _ t e r m d q b 1 _ t e r m d q b 2 _ t e r m d q b 3 _ t e r m d q b 4 _ t e r m d q b 5 _ t e r m d q b 6 _ t e r m d q b 7 _ t e r m d q b 8 _ t e r m c t m _ t e r m _ l c t m n _ t e r m _ l left rdram device of "term" channel s i n _ t e r m s c k _ t e r m c m d _ t e r m d q a 8 d q a 7 d q a 6 d q a 5 d q a 4 d q a 3 d q a 2 d q a 1 d q a 0 c f m c f m n c t m c t m n r o w 2 r o w 1 r o w 0 c o l 4 c o l 3 c o l 2 c o l 1 c o l 0 d q b 0 d q b 1 d q b 2 d q b 3 d q b 4 d q b 5 d q b 6 d q b 7 d q b 8 sio 0 sio 1 sck cmd v ref ( 256/288mb) . . . right rdram device of "term" channel s da v term g nd 1 p er 2 termination resistors v term c m d _ t h r u _ r s c k _ t h r u _ l 2 8 w 3 9 w 9 1 w 1 0 k w 2 8 w 3 9 w 9 1 w module capacity n 512/576mb 16 256/288mb 8 128/144mb 4 note : * 0.1uf : 800mhz products for 128/144mb and 256/288mb * 0.22uf : the other products 47kohm
page 8 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 absolute maximum ratings dc recommended electrical conditions 32 bit rimm module capacity and number of rdram device table 4 : absolute maximum ratings symbol parameter min max unit v i,abs voltage applied to any rsl or cmos signal pad with respect to gnd - 0.3 v dd + 0.3 v v dd,abs voltage on vdd with respect to gnd - 0.5 v dd + 1.0 v t store storage temperature - 50 100 c t plate plate temperature - 92 c table 5 : dc recommended electrical conditions symbol parameter and conditions min max unit v dd supply voltage a a. see direct rdram datasheet for more details 2.50 - 0.13 2.50 + 0.13 v v cmos cmos i/o power supply at pad for 2.5v controllers cmos i/o power supply at pad for 1.8v controllers vdd 1.8 - 0.1 vdd 1.8 + 0.2 v v v ref reference voltage a 1.4 - 0.2 1.4 + 0.2 v svdd serial presence detector- positive power supply 2.2 3.6 v v term termination voltage 1.8 - 0.09 1.8 + 0.09 v v term v ref nominal rsl signal half swing - 0.46 v table 6: 32 bit rimm module capacity and number of rdram device 512/576mb 256/288mb 128/144mb unit number of 256/288mb rdram devices 16 8 4 pcs channel 1 channel 2 8 8 4 4 2 2
page 9 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 32 bit rimm module current profile table 7 : 32bit rimm module current profile i dd total 32 bit rimm module capacity 32 bit rimm module power conditions a a. actual power will depend on memory controller and usage patterns. power does not include refresh current. 512/576mb 256/288mb 128/144mb unit max max max i dd1 one rdram device per channel in read b , balance in nap mode b. i/o current is a function of the % of 1?s, to add i/o power for 50% 1?s for a x16 need to add 257ma or 290ma for x18 ecc modu le for the follow- ing: v dd = 2.5v, v term = 1.8v, v ref = 1.4v and v dil = v ref - 0.5v. rimm 4200 1356/1456 c c. current values represent x32 (non-ecc) / x36(ecc) 1324/1424 1308/1408 ma rimm 3200 1116/1176 1084/1144 1068/1128 i dd2 one rdram device per channel in read b , balance in standby mode rimm 4200 2700/2800 1900/2000 1500/1600 ma rimm 3200 2180/2240 1540/1600 1220/1280 i dd3 one rdram device per channel in read b , balance in active mode rimm 4200 3400/3500 2200/2300 1600/1700 ma rimm 3200 2740/2800 1780/1840 1300/1360 i dd4 one rdram device per channel in write, balance in nap mode rimm 4200 1516/1636 1484/1604 1468/1588 ma rimm 3200 1206/1296 1174/1264 1158/1248 i dd5 one rdram device per channel in write, balance in standby mode rimm 4200 2860/2980 2060/2180 1660/1780 ma rimm 3200 2270/2360 1630/1720 1310/1400 i dd6 one rdram device per channel in write, balance in active mode rimm 4200 3560/3680 2360/2480 1760/1880 ma rimm 3200 2830/2920 1870/1960 1390/1480
page 10 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 ac electrical specifications table 8 : ac electrical specifications symbol parameter and conditions: a 128mb, 256mb, 512mb modules a. specifications apply per channel min typ max unit z l module impedance of rsl signals 25.2 28.0 30.8 w z ul-cmos module impedance of sck and cmd signals 23.8 28.0 32.2 w t pd propagation delay variation of rsl signals. average clock delay from finger to finger of all rsl clock nets (ctm, ctmn, cfm, and cfmn) see table10 b b. t pd or average clock delay is defined as the delay from finger to finger of rsl signal. ps d t pd propagation delay variation of rsl signals with respect to t pd a, c c. if the module meets the following specification, it is compliant to the specification. if the module does not meet these spec ifications, the specifica- tion can be adjusted by the ?adjusted d t pd specification? table 9 below. adjusted d t pd specification -21 21 ps d t pd-cmos propagation delay variation of sck signal with respect to an average clock delay a -250 250 ps d t pd-sck,cmd propagation delay variation of cmd signal with respect to sck signal -200 200 ps v a /v in attenuation limit 17.0 % v xf /v in forward crosstalk coefficient (300ps input rise time @ 20%-80%) 4.0 % v xb /v in backward crosstalk coefficient (300ps input rise time @ 20%-80%) 2.0 % r dc dc resistance limit - - 0.8 w table 9 : adjusted d t pd specification symbol parameter and conditions adjusted min/max absolute min / max unit d t pd propagation delay variation of rsl signals with respect to t pd for 4, 8 and 16 device modules +/- [17+(18*(n/ 2) * d z0)] a a. where: n = number of rdram devices installed on the rimm module d z0 = delta z0% = (max z0 - min z0)/(min z0) (max z0 and min z0 are obtained from the loaded (high impedance) impedance coupons of all rsl layers on the modules) -30 30 ps
page 11 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 32 bit rimm module t pd specification table 10 : 32 bit rimm module t pd specification i dd 32 bit rimm module capacity 512mb 256mb 128mb unit parameter and condition for rimm4200, rimm3200 max max max t pd propagation delay per channel, all rsl signals 1.36 1.02 0.89 ns
page 12 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 figure 3 : 32 bit rimm module pcb physical dimensions physical dimensions -1 ( for pcb ) the following defines the 2 channel rdram module dimensions. all units are in millimeters with inches in brackets[ ], where app ropriate. the dimensions without tolerance specification use the default tolerance of 0.127[ 0.005]. 0.80 0.10 0.15 0.10 2.99 0.05 [0.031 0.004] [0.006 0.004] [0.12 0.002] detail a 3.00 0.10 3.00 0.10 detail b [0.118 0.004] [0.118 0.004] min.4.88 [0.192] 1.00 [0.039] heat spreader 133.35 0.127[5.250 0.005] 1.00[0.039] 5.68[0.2236] 3 4 . 9 3 [ 1 . 3 7 5 ] a-1 a-116 2.85[0.112] 2.85[0.112] r 2.00 component area (a side) dia 2.44 127.65[5.026] 4.00 0.15 [0.157 0.006] 3 2 . 0 8 [ 1 . 2 6 ] 1 7 . 7 8 [ 0 . 7 0 0 ] b-1 r 2.00 dia 2.44 b-116 8.60[0.339] note : the gray area above represents the contact surface of the heat spreader. component area (b side) 7.468[0.294]
page 13 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 physical dimensions -2 ( for heat spreader ) the following defines the 2 channel rdram module dimensions. all units are in millimeters with inches in brackets[ ], where app ropriate. the dimensions without tolerance specification use the default tolerance of 0.127[ 0.005]. figure 4: heat spreader physical dimensions 133.35 0.127[5.250 0.005] 2 9 . 4 2 [ 1 . 1 5 8 ] 3 4 . 9 3 [ 1 . 3 7 5 ] a a 2.9 1.00 0.07 [0.04 0.002] [0.114] material csp 1.27 0.10 [0.050 0.004] thermal conductive gap filling max 7.80 [0.307] pcb heat spreader [ double side module ] section a-a material csp 1.27 0.10 [0.050 0.004] thermal conductive gap filling max 4.70 [0.185] pcb heat spreader [ single side module ] section a-a 112.7 0.12[4.436 0.005] 132.76 0.25[5.226 0.009] 127.66 0.12[5.023 0.005] 12.7 0.07[0.5 0.002] 12.7 0.07[0.5 0.002] 2 9 . 4 2 [ 1 . 1 5 8 ] warning ! hot surface http://www.samsungsemi.com warning ! hot surface http://www.samsungsemi.com center-point dia 2.36 0.05[0.09 0.001]
page 14 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 32 bit rimm module marking the 32 bit rimm modules available from samsung are marked like figure 5 below. this marking also assists users to specify and verify if the correct 32 bit rimm modules are installed in their systems. in the diagram, a label is shown attached to the 32 bit rimm module ? s heat spreader. information contained on the label is specific to the 32 bit rimm module and provides rdram information without requiring removal of the 32 bit rimm module?s heat spreader. a b c d e f g j h k i md18r162gdf0-cn9 rimm 4200 102 korea 0240 512mb /16 ecc label field description marked text unit a vendor logo 32 bit rimm vendor samsung logo area samsung - b country country of origin korea - c year & week code manufactured year & week code yyww - d module memory capacity number of 8-bit or 9-bit mbytes of rdram storage in 32 bit rimm module 128mb, 256mb, 512mb - e number of rdrams number of rdram devices contained in the 32 bit rimm module 4/8/16 rdram devices f ecc support indicates whether the 32 bit rimm module supports 8 (non ecc) or 9 (ecc) bit bytes blank = 8 bit bytes ecc = 9 bit bytes - g notice! hot surface caution notice. - - h caution logo iso standard - - i gerber & spd version pcb gerber file & spd code version used on 32 bit rimm module gerber : 10 = 1.0 ver. spd : 2 = 1.3 ver. - j product name product name rimm 4200, rimm 3200 - k part no. samsung 32 bit rimm part no. see table 1 - figure 5 : 32 bit rimm marking example
page 15 version 1.0 july 2002 32 bit rimm ? module md16r1624(8/g)df0 md18r1624(8/g)df0 table of contents overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 key timing parameters/part numbers . . . . . . . . . . . . . . . . 1 module pad numbers and signal names . . . . . . . . . . . 2 - 3 module connector pad description . . . . . . . . . . . . . . . 3 - 6 32 bit rimm module functional diagram . . . . . . . . . . . . . 7 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . 8 dc recommended electrical conditions . . . . . . . . . . . . . . 8 32 bit rimm module supply current profile . . . . . . . . . . . 9 ac electrical specifications . . . . . . . . . . . . . . . . . . . 10 - 11 physical dimensions -1 ( for pcb ) . . . . . . . . . . . . . . . . . 12 physical dimensions -2 ( for heat spreader) . . . . . . . . . . 13 standard 32 bit rimm module marking . . . . . . . . . . . . . 14 copyright ? july 2002, samsung electronics. all rights reserved. direct rambus and direct rdram, so-rimm and rimm are trademarks of rambus inc. rambus, rdram, and the rambus logo are registered trademarks of rambus inc. this document contains advanced information that is subject to change by samsung electronics without notice document version 1.0 samsung electronics co. ltd. san #16 banwol-ri, taean-eup hwasung-city, gyeonggi-do, korea telephone: 82-31-208-6369 fax: 82-31-208-6799 http://www.intl.samsungsemi.com

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